Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.
1～14 item / All 14 items
Explaining the causes of motor heat generation and evaluation techniques! A detailed explanation of heat dissipation and cooling technologies!
Introducing the characteristics of heat-resistant materials, insulating films, and magnet wires! Also featuring the latest superconducting motors and motor waste heat utilization technology!
Understanding the overall picture of technology and companies in the early stages of research and development.
The 'Countermeasures for Abnormal Heating in All-Solid-State Batteries' is a patent guidebook suitable for the planning of new business projects and the discovery of invention insights, connecting technology and patents. Focusing on specific technological themes, it is compiled at an easily understandable level, and this series has carefully selected approximately 100 essential pieces of information from the latest patent information from the perspective of engineers, serving as an appropriate guide for exploring the future direction engineers should take. 【Angle (Technical Classification)】 ■ Internal short circuit mitigation measures ■ Current limiting measures ■ Heat dissipation measures ■ Heat absorption measures ■ Pressure reduction for clamping ■ Current short circuit measures ■ Others *For more details, please download the PDF or feel free to contact us.
[Construction Case] Reduction of Electricity Costs for Refrigerated Containers
Usage: Refrigerated container Installed products: Roof) Thermo Barrier Sky Ceiling, Wall) Thermo Barrier S Installation area: 160m² Installation period: Installed in March 2022 Installation days: 2 days Reason for introduction: Adopted to reduce electricity costs (air conditioning expenses in summer).
Electronic Patent Technology Trend Survey Report on Motor Heat Management
The high performance of motors is rapidly advancing. Behind this are future needs such as EVs and robotics, and according to patent information, one of the factors driving this high performance could be thermal management.
From components to devices! Introducing various thermal management solutions for electronic equipment tailored to different purposes and applications.
Heat countermeasures refer to the prevention of problems caused by heat. To achieve this, it is important to organize the flow of heat from its generation, identify issues, and resolve those issues. 【Heat Countermeasures by Electronic Device】 ■Components Heat sinks are the main players. They are determined by the size and amount of heat generated by the heat source. ■Equipment Fans are the main players. In the case of sealed equipment or when temperature control is necessary, SAMOL comes into play. ■Systems POWER SAMOL is recommended. Selection is based on the amount of heat generated, the size of the system, and the surrounding temperature. ●For more details, please download the catalog or contact us.
![[Series Volume 7] Column written by Naoki Kunimine, Thermal Design Consultant](https://image.mono.ipros.com/public/product/image/03e/2001197481/IPROS25468395333723263732.png?w=280&h=280)
<Free Offer> From my position, having been involved in thermal design for many years, I would like to share my thoughts on thermal design that I have on a daily basis.
Written by Mr. Naoki Kunimine, President of Thermal Design Lab Inc. This is a column document reflecting on 45 years of involvement in thermal design, titled "A Collection of Thermal Design Stories." Due to the positive feedback from readers, we are distributing the 7th installment of the column. 【Content Summary (Excerpt)】 The author first heard the term "thermal design" over 40 years ago. In the 7th installment, following the 5th and 6th installments, we will focus on the "printed circuit board," which is central to thermal design, and discuss specific countermeasures. ■ Thermal measures for the circuit board are carried out through "heat source dispersion" and "heat diffusion." ■ Heat source dispersion achieves the same effect as "improving the thermal conductivity of the circuit board." ■ Forming a heat dissipation pattern with copper foil to diffuse heat within the circuit board. *For more details, please refer to the PDF document or feel free to contact us.
![[Final Installment] Column Written by Naoki Kunimine, Thermal Design Consultant](https://image.mono.ipros.com/public/product/image/f9b/2001481728/IPROS11532168417679745022.png?w=280&h=280)
<Free Giveaway> From my position of having been involved in thermal design for many years, I would like to share my thoughts on thermal design.
Written by Mr. Naoki Kunimine, President of Thermal Design Lab Inc. This is a column material reflecting on 45 years of involvement in thermal design, titled "Miscellaneous Stories of Thermal Design." Due to the favorable response from readers, we are distributing the 8th installment (final edition) of the column. 【Content Overview (Excerpt)】 The author first heard the term "thermal design" over 40 years ago. In the 8th installment, we will focus on the "printed circuit board," which is central to thermal design, and discuss specific implementation methods for thermal countermeasures that can be applied to the board. ■ There are mainly four thermal countermeasures that can be applied to the board ■ Reduce the thermal resistance between components (heat sources) and the board ■ Increase the thermal diffusion capability of the board itself ■ Enhance heat dissipation from the surface of the board ■ Reduce heat absorption from adjacent components *For more details, please refer to the PDF material or feel free to contact us.
Introducing an experimental verification on "how much difference substrate patterning makes in thermally demanding circuits!"
An important factor in machine design, circuit design, and substrate design is "controlling heat." The heat dissipation path, from the perspective of thermal resistance, is significantly large, as heat conducted from components to the substrate wiring is transmitted into the air. With the recent trend of high-density integration of components and miniaturization of devices, the importance of measures through substrate patterning has been increasing. Here, we will introduce specific thermal countermeasures based on verification experiments regarding "how much difference substrate patterning can make in thermally demanding circuits." *For detailed content of the article, please refer to the related links. For more information, feel free to contact us.*
Ideal for heat countermeasures! Provides a quiet and stable airflow from a lightweight and compact body.
At Sanyo Security Industry Co., Ltd., we propose the "Induction Fan" as a measure against heat stress. The "Induction Fan (SF type)" is a compact axial flow fan developed to efficiently blow air in limited spaces and with minimal weight. It demonstrates its power in areas where installation space and noise are critical, providing an efficient, economical, and high-performance means of air blowing. 【Features】 ■ Excellent workability ■ Reduced initial and running costs ■ Energy-saving ■ Easy installation ■ Space-saving for ducts *For more details, please refer to the PDF materials or feel free to contact us.
We will diagnose the condition of the customer's factory and select paint according to their needs.
The condition of the factory varies. In addition to solving the current issues we face, it is necessary to have plans that look towards the future. We will supply the "joy" of painting in a visible form and provide quality, safety, and effectiveness that will impress. *For more details, please refer to the PDF document or feel free to contact us.
[Construction Example] Seeking Comfort in the Car
This is an introduction to heat insulation measures for the Hiace, showcasing construction examples. We implemented creative heat insulation measures for each area. On the roof, we applied double-sided tape and attached a sky sheet. The edges were taped with glass cloth tape. For the interior ceiling, we used double-sided tape to attach Thermo Barrier S. For the walls, we removed the dashboard and installed Thermo Barrier Fit inside.
Electronic Patent Technology Trend Survey Report on Thermal Management of SiC/GaN High-Temperature Semiconductors
You can view patent information categorized by the following technical classifications: - Mixing and separation - Reduction of thermal resistance - Thermal stress - Electrical characteristics - Air cooling thermal measures - Liquid cooling thermal measures - Related thermal measures - Related thermal measures
★Necessary thermal design in the development stage of printed circuit boards ★A comprehensive explanation of the theory of thermoelectricity from scratch ★Essential course for improving reliability
Speaker Naoki Kunimine, President of Thermal Design Lab - Introduction to Thermal Fluid Analysis for Electronic Devices (Nikkan Kogyo Shimbun, 2009) - Thermal Design for Electronic Devices, 2nd Edition (Nikkan Kogyo Shimbun, 2006) - Complete Introduction to Thermal Design (Nikkan Kogyo Shimbun, 1997) Target Audience: Designers of printed circuit boards who want to master thermal design Venue: Kawasaki City Educational and Cultural Center, Conference Room 1 [Kanagawa, Kawasaki] 10-15 minutes walk from JR or Keikyu Line Kawasaki Station Date and Time: June 29, 2011 (Wednesday) 10:00 AM - 4:45 PM Capacity: 30 participants. *Registration will close once full. Please apply early. Participation Fee: 49,350 yen (tax included, including text costs) for up to 2 participants from one company ⇒ ◆ Invoices for 2 participants can be split into 2 parts (please indicate "request for invoice split" in the remarks section) *New members registering for the first time by June 14 will receive an early bird discount price of 44,100 yen. ◆ If 3 participants from the same organization apply, the fee is 61,950 yen.
